Layers:1-30 layers
Max manufacturing size:600mm*1100mm
Board thickness: Double sided: 0.2mm-6.0mm
4 layers: 0.4mm-8.0mm
6 layers:0.8mm-8.0mm
8 layers:1.0mm-8.0mm
10 layers:1.2mm-8.0mm
12 layers:1.5mm-8.0mm
copper:0.5OZ-10OZ
Min line width/space:3mil/3mil
Min finished holes size::0.15mm(machine drilling)/4mil(laser-drilling)
Aspect ratio:1:12
Min ring width:3mil
Min interlamination thickness:3mil
Solder bridge:≥0.1mm
Plug hole ability:0.2-0.6mm
Impedance control:+/-10%
Surface:HAL、HASL with Pb free、Immersion Gold、Flash Gold、Gold Finger、Immersion Tin、Immersion silver、OSP、OSP+ENIG
Tolerance:
Trough-Hole:±0.075mm
Non-Trough-Hole:±0.05mm
Outline Tolerance:±0.1mm
Function Test:
Insulation Resistance: 50 ohms( normal )
Peel strength: 1.4N/mm
Thermal Stress Test : 280 ℃, 20秒
Solder mask Pencil Test: ≥6H
Test Voltage: 10V-250V
Warp-twist: ≤0.7%
Special technique: blind&buried holes、 via in pad、Semi-plating holes,、countersinked holes、Step mounting holes、controlled depth holes、Edge-plating PCB and metal base PCB